Leiterplatten-Herstellung
Leiterplattenvielfalt



- Einlagige- / Beidseite Leiterplatten PCB
- Multi-Lagen PCB (2 to 40 Lagen)
-
- Starre Leiterplatten (2 to 40 Lagen)
- Flexibel-Starre (Rigid-Flex) Leiterplatten (2 to 16 Lagen)
- Flexible Leiterplatten (2 to 6 Lagen)
- Impedanzkontrollierte Leiterplatten
- Buried & Blind Vias
- Hochfrequenz Leiterplatten
- High-Tg Leiterplatten
Oberflächen-Finish
- HASL
- Bleifreies HASL
- OSP
- Immersion Gold
- Immersion Zinn
- Immersion Silber
- Plated Gold
- Partial Gold
- Gold finger
Materialarten
- FR4
- FR5
- High TG-170
- Hochfrequenz (Teflon/Roger/Arlon)
- Halogenfrei
- Flexibel-Starr (Rigid-Flex)
Herstellungsmöglichkeiten
Maximum Board Size | 20 by 30 inch |
Board Thickness | 0.21-6.0mm |
Min. Trace Width | 3mil (inner and outer) |
Min. Trace Gap | 3mil (inner and outer) |
Outer Layer Copper Thickness | 5oz |
Inner Layer Copper Thickness | 5oz |
Min. Finished Hole Size (Mechanical) | 0.2mm |
Min. Finished Hole Size (Laser) | 0.1mm |
Aspect Ratio | 16:1 |
Solder mask color | Green, Blue, Red, White, Black |
Impedance Control Tolerance | 5% |
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Copyright @ 2013 H.H. Wohlers Handelsgesellschaft mbH
Handelsregister Bad Oeynhausen 16 HRB 1978